Intel and AMD Will Show Off Partnership at CES 2018

Last Edited: August 28, 2018 | Published: December 22, 2017 by

Intel and AMD Will Show Off Partnership at CES 2018

Not too long ago I told you about the unprecedented partnership between Intel and AMD. Now it seems the two companies plan to show off their new technology at CES 2018.

The new chip, which is technically part of the Intel eighth generation i series of chipsets, will combine the processor technology of Intel along with the graphics processor prowess of AMD to create a chip that will allow PC makers to create laptops that are even thinner and lighter while also improving the battery life of these much needed devices.

The new combo chips make use of Intel’s processor technology along with AMD’s Vega graphics processors to create a combo chip that has never before been seen in the PC market and could create some gaming laptops with integrated graphics that can compete a lot more effectively with dedicated graphics cards. This chip is powerful yet very efficient, requiring less cooling and power so our laptops can get even thinner and lighter than ever.

If you didn’t catch the initial announcement and press release, here is what Intel had to say about this partnership:

“The new product, which will be part of our eighth-gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group — all in a single processor package. It’s a prime example of hardware and software innovations intersecting to create something amazing that fills a unique market gap. Helping to deliver on our vision for this new class of product, we worked with the team at AMD’s Radeon Technologies Group. In close collaboration, we designed a new semicustom graphics chip, which means this is also a great example of how we can compete and work together, ultimately delivering innovation that is good for consumers.”

How do they do this? It all comes down to Embedded Multi-Die Interconnect Bridge (EMIB), which is simply a way to bridge the two different silicon technologies used by the companies. “”At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.”

Now I don’t know about you, but ever since this original announcement I have been waiting to see what these chips would be like and how computer manufacturers would make use of them in their designs. While we don’t know exactly what will be seen at CES 2018 in regards to these chips, I’m hoping we will get a glimpse of a prototype laptop or two powered by this new series of chips.

While they won’t have the power of discrete graphics, they will offer an improvement over Intel graphics, which could allow for better gaming and video processing in a much thinner package. Now this is something we would all love to see.

What do you think about this partnership? Are you looking forward to seeing it at CES 2018? If so, tell me your thoughts in the comments below.

About the author

Matt Garrett

Matt is an IT professional with over fifteen years experience supporting network infrastructure and computers. An avid gamer, Matt enjoys his time playing and writing about his experiences both in the IT world and in the gaming communities. You can find more of his writing for LaptopNinja where he enjoys talking about everything tech.

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